| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem that it is impossible to mount efficiently and in a short time a flip chip mounted semiconductor and a solder mounted component on electronic equipment in a mixed manner and in close vicinity to each other, to propose a new flux applying method and a solder supplying method, and to provide a mounting method suitable for miniaturization of the electronic equipment. <P>SOLUTION: After a semiconductor chip is flip chip mounted on a circuit board, flux is applied to a component mounting land in one lot. Then, a solder chip structured to hold a plurality of solder pieces on a flux permeable base is placed thereon, and the chip component is placed on the solder chip and is connected to the circuit board by a reflow process. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
