| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum suction apparatus which has a superior durability and can secure a good planarity for a suction surface and can be easily manufactured. SOLUTION: The vacuum suction apparatus 10 comprises a placement 11 formed of a ceramic/glass composite porous material and an annular placement 12 formed of a ceramic/glass composite porous material and arranged around the placement 11, which are for sucking and supporting a semiconductor wafer W; and a support 13 which contains suction holes 14 communicating with pores of the placement 11 and supports the placement 11 and the annular placement 12. There is essentially no space between the placement 11 and the annular placement 12, and these two are directly joined together. COPYRIGHT: (C)2006,JPO&NCIPI |
