| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayered wiring board which can achieve a high adhesion between an insulating layer and a conductor layer, and to provide the multilayered wiring board. SOLUTION: The method of manufacturing the multilayered wiring board is for manufacturing a multilayered wiring board X1 containing the conductor layers 40 which are multilayered via the insulating layers 20 and 30, and comprises, for example, a process wherein a coupling agent containing a functional group which can bond with an inorganic material is attached to a supporting material formed of an inorganic material, via the functional group to form a coupling agent film on the surface of the supporting material; a process of transferring the coupling agent film onto the insulating layer 20; and a process of forming the conductor layer 40 formed of an inorganic material on the coupling agent film. COPYRIGHT: (C)2006,JPO&NCIPI |
