发明名称 METHOD OF FORMING FERROELECTRIC FILM, AND METHODS OF MANUFACTURING CAPACITOR AND SEMICONDUCTOR MEMORY DEVICE USING THE METHOD
摘要 PROBLEM TO BE SOLVED: To provide a method of forming a ferroelectric film, and also to provide methods of manufacturing a capacitor and a semiconductor memory device that uses the method. SOLUTION: There is provided the method of forming a ferroelectric film comprising steps of: preparing a substrate; depositing an amorphous ferroelectric film on a substrate; irradiating the amorphous ferroelectric film with laser beam; and crystallizing the amorphous ferroelectric film. Also provided are: a method of manufacturing a capacitor, in which the ferroelectric film is formed using the method of manufacturing the ferroelectric film; and a method of manufacturing a semiconductor memory device using the method of manufacturing the capacitor. Accordingly, the ferroelectric film is formed at a temperature lower than 500°C, and the thermal damage of the other member is reduced, in forming ferroelectric film. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006093713(A) 申请公布日期 2006.04.06
申请号 JP20050277073 申请日期 2005.09.26
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 XIANYU WENXU;NOGUCHI TAKASHI;CHO SE-YOUNG;KWON JANG-YEON;YIN HUAXIANG
分类号 H01L27/105;H01L21/316;H01L21/8246 主分类号 H01L27/105
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