发明名称 |
METHOD OF FORMING FERROELECTRIC FILM, AND METHODS OF MANUFACTURING CAPACITOR AND SEMICONDUCTOR MEMORY DEVICE USING THE METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming a ferroelectric film, and also to provide methods of manufacturing a capacitor and a semiconductor memory device that uses the method. SOLUTION: There is provided the method of forming a ferroelectric film comprising steps of: preparing a substrate; depositing an amorphous ferroelectric film on a substrate; irradiating the amorphous ferroelectric film with laser beam; and crystallizing the amorphous ferroelectric film. Also provided are: a method of manufacturing a capacitor, in which the ferroelectric film is formed using the method of manufacturing the ferroelectric film; and a method of manufacturing a semiconductor memory device using the method of manufacturing the capacitor. Accordingly, the ferroelectric film is formed at a temperature lower than 500°C, and the thermal damage of the other member is reduced, in forming ferroelectric film. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2006093713(A) |
申请公布日期 |
2006.04.06 |
申请号 |
JP20050277073 |
申请日期 |
2005.09.26 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
XIANYU WENXU;NOGUCHI TAKASHI;CHO SE-YOUNG;KWON JANG-YEON;YIN HUAXIANG |
分类号 |
H01L27/105;H01L21/316;H01L21/8246 |
主分类号 |
H01L27/105 |
代理机构 |
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地址 |
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