| 摘要 |
PROBLEM TO BE SOLVED: To prevent a solid film from being formed in a portion facing a gas flow passage in a valve device, especially a valve device for making flow therethrough a solid-substance generating gas. SOLUTION: In a semiconductor manufacturing apparatus, there is provided a valve device comprising a fixed part such as a valve box 2, etc. having the gas flow passage and a movable part such as a valve body 9, etc. for opening or closing the gas flow passage between a reactor chamber and an exhausting pump. In this case, a heater 31 for the fixed part is attached to the fixed part in which a heater heats a part adjacent to a gap between the valve box 2 and the valve body, when exhaust gas exhausted accompanied by treatment in the reactor chamber flows through the gas flow passage. COPYRIGHT: (C)2006,JPO&NCIPI
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