发明名称 |
Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same |
摘要 |
A die-attach composition includes a resin such as a thermosetting resin, a hardener, and a low molecular weight oligomer diluent. A die-attach composition includes a polyimide in a major amount and a resin such as a thermosetting resin in a minor amount. The die-attach composition also includes a reactive polymer diluent. Combinations of the low molecular weight oligomer diluent and the reactive polymer diluent are included. The die-attach composition is applied to surface mount technology such as wire-bond dice. A computing system is also included that uses the die-attach composition. |
申请公布号 |
US2006073624(A1) |
申请公布日期 |
2006.04.06 |
申请号 |
US20040956624 |
申请日期 |
2004.09.30 |
申请人 |
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发明人 |
MANEPALLI RAHUL N.;TANIKELLA RAVINDRA V. |
分类号 |
H01L21/00;B41J2/16 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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