| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive resist composition having preferable sensitivity, resolution and a pattern profile, small line edge roughness and preferable surface roughness, and to provide a method for forming a pattern by using the above composition, as a positive resist composition to be used for manufacturing a semiconductor integrated circuit device, a mask for fabrication of integrated circuits, or the like, and a method for forming a pattern by using the composition. <P>SOLUTION: The positive resist composition is provided which contains: (A) a compound which generates an acid by irradiation with active rays or radiation; and (B) a resin having a specified repeating unit, the solubility of which with an alkali developer solution increases by the effect of an acid. The method for forming a pattern by using the composition is also provided. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
