发明名称 POSITIVE RESIST COMPOSITION AND METHOD FOR FORMING PATTERN BY USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To solve problems about techniques of improving performances in microfabrication of a semiconductor device using high-energy beams, X-rays, electron beams or EUV light, to provide a positive resist composition having all of satisfying high sensitivity, high resolution and preferable line edge roughness, and to provide a method for forming a pattern by using the composition. <P>SOLUTION: The positive resist composition contains: (A) a resin which contains a repeating unit having a specified styrene skeleton and a repeating unit having a specified cyclic structure and which becomes soluble with an alkali developer solution by the effect of an acid; and (B) a compound which generates an acid by irradiation with active rays or radiation. The method for forming a pattern is carried out by using the resist composition. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006091578(A) 申请公布日期 2006.04.06
申请号 JP20040278320 申请日期 2004.09.24
申请人 FUJI PHOTO FILM CO LTD 发明人 SASAKI TOMOYA
分类号 G03F7/039;C08F212/14;H01L21/027 主分类号 G03F7/039
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