发明名称 LASER-INDUCED MODIFICATION APPARATUS AND METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser-induced modification apparatus and method which can improve a machining quality and a modification quality by preventing occurrence of cracks, rough surface, peeling and bulging caused by thermal shock. <P>SOLUTION: The laser-induced modification apparatus is characterized in that it is equipped with a laser generator 1 which generates a ultra short pulse laser having a pulse width of 10 fs-50 ps and laser irradiation means 1, 2, 5 which irradiate a workpiece with the ultra short pulse laser from the laser generator at a fluence not less than the threshold for reforming the workpiece, wherein the the ultra short pulse laser has a pedestal component in the range of 5-50% of the energy of the ultra short pulse laser. Irradiating the workpiece with the ultra short pulse laser having the pedestal component adds a pre- and/or a post-thermal treatment by a sub-pulse before and after an adiabatic machining with the main pulse, thereby relaxing/restoring the main pulse-caused thermal shock effects (cracks, rough surface, peeling, rising, etc.) and enabling the machining/reforming quality to be improved. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006088199(A) 申请公布日期 2006.04.06
申请号 JP20040277440 申请日期 2004.09.24
申请人 AISIN SEIKI CO LTD 发明人 YOSHIDA MUTSUMI;SUGIURA TOSHIJI
分类号 B23K26/06;B23K26/00;B23K26/08;H01S3/06 主分类号 B23K26/06
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