| 摘要 |
PROBLEM TO BE SOLVED: To provide a board processor which improves temperature drop rate and reduces temperature differences between wafers and in a wafer surface. SOLUTION: A CVD system 10 comprises a process tube 31 composing a wafer processing chamber 32, a heater unit 50 which heats the processing chamber 32, and a boat 30 which transfers a group of wafers 1 to the processing chamber 32. The CVD system 10 is also provided with a cooling gas supply unit 70 arranged along the inner peripheral surface of the processing chamber 32. The cooling gas supply unit 70 includes suction nozzles 71, 72, 73 each forming a suction chamber, and blowoff nozzles 81, 82 each forming a blowoff chamber. Each of three suction nozzles 71, 72, 73 has each slit 71b, 72b, 73b from which a nitrogen gas 90 is jetted to the blowoff chambers 81b, 82b, and each of two blowoff nozzles 81, 82 has each blowoff slit 81c, 82c from which the nitrogen gas 90 is jetted to the blowoff chambers 81b, 82b is then jetted to the processing chamber 32. The nitrogen gas 90 is jetted from the blowoff chambers 81c, 82c uniformly to the processing chamber 32, and cools the wafers 1 rapidly and uniformly. COPYRIGHT: (C)2006,JPO&NCIPI
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