| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable wiring board (mother board, and semiconductor chip mounted substrate) and semiconductor package that maintain insulation reliability between wirings and have fine wirings, and to provide a manufacturing method therefor. SOLUTION: The wiring board comprises an interlayer insulating layer, one or more layers of wirings, and a mixed layer which includes a metal and an insulation material between at least the one layer of wirings and the interlayer insulation layer. The mixed layer is removed such that an insulation resistance value between the wirings becomes 1 GΩor over. COPYRIGHT: (C)2006,JPO&NCIPI |
