TRANSFER FILM SUBSTRATE FOR SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE USING IT

摘要

PROBLEM TO BE SOLVED: To provide a transfer film substrate for a semiconductor device which makes easy transfer of a wiring conductor formed on a transfer film to a sealing resin. SOLUTION: In the transfer film substrate 1 for the semiconductor device in which the wiring conductor 5 is formed on the transfer film 2, the wiring conductor 5 is formed by press punching a conductive metal tape 5t, and the wiring conductor 5 is temporarily press bonded on the transfer film 2. COPYRIGHT: (C)2006,JPO&NCIPI