| 摘要 |
PROBLEM TO BE SOLVED: To prevent the generation of a hydrogen gas at the time of processing of silicon while suppressing a rise in the viscosity of slurry. SOLUTION: This silicon processing water-soluble cutting agent composition is prepared by compounding an oxidizing agent for oxidizing a silicon fine powder with a silicon processing water-soluble cutting agent. COPYRIGHT: (C)2006,JPO&NCIPI |
