| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of modularizing a circuit board capable of making both of wire bonding property and mold resin adhesion compatible. SOLUTION: In this method of modularizing the circuit board, a component to be mounted on the circuit board having a gold-plated wiring pattern is subjected to die bonding, the electrically conductive adhesive for the die bonding is cured and wire bonding is carried out, and then the circuit board and the component are sealed and covered with a molding resin. Before the wire bonding, the electrically conductive adhesive is temporarily cured at such a relatively low temperature that nickel hydroxide does not deposit on the gold plating, and after the wire bonding, the electrically conductive adhesive is actually cured at such a relatively high temperature that nickel hydroxide deposits on the gold plating. COPYRIGHT: (C)2006,JPO&NCIPI |
