| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer support in which reduction performance of slip occurring in a wafer during heat treatment can be enhanced. SOLUTION: The wafer support has a planar portion 5 in which a through hole 3 is formed, and an annular portion 7 provided on one side of the planar portion 5 to surround the through hole 3. The annular portion 7 is composed of a material having a coefficient of thermal expansion identical to that at a portion of a wafer 9 being mounted on the annular portion 7 where the wafer 9 touches the annular portion 7. COPYRIGHT: (C)2006,JPO&NCIPI |
