发明名称 MULTILAYER PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board wherein a transmission loss is lower, and an optical signal transmission capacity is excellent, in optical signal transmission through an optical path for the optical signal transmission. SOLUTION: In the multilayer printed circuit board, a conductor circuit and an insulating layer are laminated and formed at least on one surface of the substrate, the optical path consisting of a resin component for the optical signal transmission is formed, and the conductor circuit is formed on the outermost insulating layer. An end of the optical path for the optical signal transmission is protruded from a surface of the outermost insulating layer. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006093618(A) 申请公布日期 2006.04.06
申请号 JP20040280244 申请日期 2004.09.27
申请人 IBIDEN CO LTD 发明人 KODAMA HIROAKI;YAMADA KAZUHITO
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
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