Verfahren zur Herstellung einer Anordnung aus einem Halbleiterchip und einer damit verbundenen Leiterbahnstruktur

摘要

With this method a track structure (2) is by etching on the upper surface of a metal plate or depositing on a motherboard (6). A semiconductor chip (1) is then attached to the track structure and connected to it by the contact surfaces (3) provided on the tracks, e.g. by bond wiring or flip chip assembly. After encapsulation (5) the rear surface of the motherboard is removed down to the track structure. The track structure already include any required antenna structure.