| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED device which has a good color mixing property and high light picking up efficiency to the outside (in the air), and has high luminance while ensuring miniaturization. <P>SOLUTION: The package of an LED device is formed by performing insert molding for a plurality of separated lead frames 2 to a reflection frame 1 which has high reflectance and is formed of white resin. A cavity 8 having an inner circumferential surface 7 opened upward, and a cup 11 having a tubular outer wall 9 whose bottom surface is each of the separated two lead frames 2 in the cavity 8 are formed in the reflection frame 1. A red LED chip 3 and a green LED chip 4 are adhered and fixed on the lead frame 2 positioned on the bottom surface of each cup 11. A lower side electrode of each of the LED chip 3, 4 and the lead frame 2 are electrically conducted one-on-one. An upper side electrode of each of the LED chips 3, 4 is electrically conducted to the lead frame 2 one-on-one via a bonding wire 5, and light transparent resin 6 is filled in the cavity 8. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
