| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin bond wire saw, performing cutting work with good accuracy by aligning the tip ends of abrasive grains to maintain stable working efficiency. SOLUTION: In this resin bond wire saw 1, a buffer layer 3 made of only resin is provided in the periphery of a core wire 2 made of a piano wire, or the like, and an abrasive grain layer 6 in which the abrasive grains 4 are coupled by a coupling material 5 is formed on the outer periphery of the buffer layer 3. The thickness of the buffer layer 3 is set to about 2 to 5μm, and the elastic modulus is set to 1000MPa or less. The coupling material 5 of the abrasive grain layer 6 is formed of photosensitive resin, and the elastic modulus is set to 1500MPa or less. A metal filler is added neither to the buffer layer 3 nor to the abrasive grain layer 6. COPYRIGHT: (C)2006,JPO&NCIPI
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