发明名称 Method and apparatus for real-time measurement of trace metal concentration in chemical mechanical polishing (CMP) slurry
摘要 A system (and method) for real-time measurement of trace metal concentration in a chemical mechanical polishing (CMP) slurry, includes an electromagnetic radiation flow cell carrying a CMP slurry, a slurry pickup head coupled to the flow cell, and an analyzer for measuring properties of the slurry flowing through the flow cell.
申请公布号 US2006072701(A1) 申请公布日期 2006.04.06
申请号 US20040953380 申请日期 2004.09.30
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 VAN KESSEL THEODORE G.
分类号 G01N23/223;G01T1/36 主分类号 G01N23/223
代理机构 代理人
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