METHOD OF FORMING A COATING ON A SUBSTRATE, AND A COATING THUS FORMED

摘要

The present invention relates to a method of forming a protective coating on an electronic substrate such as an IC, the protective coating having a good mechanical, chemical and physical resistance and providing a suitable non-transparency. According to the present invention a porous matrix (preferably comprising Ti02) is formed, which is filled with a filler component which can absorb or scatter light, such as TiN particles. After a curing step, a reinforcing precursor component is added. In preparing the protective coating a predetermined amount of the filler component is used in order to obtain at least 40 vol.% of the filler component in the protective coating eventually obtained, based on the porous matrix obtained.