发明名称 DEPOSITION OF RUTHENIUM METAL LAYERS IN A THERMAL CHEMICAL VAPOR DEPOSITION PROCESS
摘要 A method for depositing a Ru metal layer on a substrate is presented. The method includes providing a substrate in a process chamber, introducing a process gas in the process chamber in which the process gas comprises a carrier gas, a ruthenium-carbonyl precursor, and hydrogen. The method further includes depositing a Ru metal layer on the substrate by a thermal chemical vapor deposition process. In one embodiment of the invention, the ruthenium-carbonyl precursor can contain Ru3(CO)12. and the Ru metal layer can be deposited at a substrate temperature resulting in the Ru metal layer having predominantly Ru(002) crystallographic orientation.
申请公布号 WO2006036865(A2) 申请公布日期 2006.04.06
申请号 WO2005US34348 申请日期 2005.09.27
申请人 TOKYO ELECTRON LIMITED;YAMASAKI, HIDEAKI;KAWANO, YUMIKO;LEUSINK, GERT, J. 发明人 YAMASAKI, HIDEAKI;KAWANO, YUMIKO;LEUSINK, GERT, J.
分类号 C23C16/16;H01L21/285 主分类号 C23C16/16
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