| 发明名称 |
EPOXY RESIN COMPOSITION AND ARTICLE |
| 摘要 |
<p>Disclosed is an epoxy resin composition containing an epoxy resin dispersed silica sol and a curing agent. Such an epoxy resin composition has low viscosity and good workability, and can be cured at low temperature in short time. A cured product thereof is excellent in resistance to high temperature and high humidity. Consequently, the epoxy resin composition is suitable as a thermosetting adhesive for optical, electrical or electronic precision components.</p> |
| 申请公布号 |
WO2006035709(A1) |
申请公布日期 |
2006.04.06 |
| 申请号 |
WO2005JP17625 |
申请日期 |
2005.09.26 |
| 申请人 |
NIPPON KAYAKU KABUSHIKI KAISHA;UMEYAMA, CHIE;KAWADA, YOSHIHIRO;MITACHI, SEIKO |
发明人 |
UMEYAMA, CHIE;KAWADA, YOSHIHIRO;MITACHI, SEIKO |
| 分类号 |
C08L63/00;C08K3/36;C09J11/04;C09J163/00 |
主分类号 |
C08L63/00 |
| 代理机构 |
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