发明名称 RESIN MOLDING MOLD
摘要 <P>PROBLEM TO BE SOLVED: To mold a resin without damage by exactly clamping an article to be shaped coping with dispersion of the thickness of the article to be shaped if there is any dispersion, and to mold the resin with a good quality in good yield. <P>SOLUTION: The resin molding mold in which a cavity recessed portion 24 for the resin to be filled-in during the resin molding is mounted on an upper mold 20 and/or a lower mold 30 is characterized in that a clamp block 32 clamping the article 50 to be shaped along the circumferential margin of the cavity recessed portion 24 is mounted on one of the upper mold 20 and the lower mold 30, the clamp block 32 being movable in the direction of opening and closing the mold and being urged to the other one of the upper mold 20 and the lower mold 30, that a movable block 34 having a flat surface shape formed coincidently with the flat surface shape of the cavity recessed portion 24 and guided movably in the direction of opening and closing the mold by the clamp block 32 is mounted on one of the upper mold 20 and the lower mold 30, and that position adjusting means 38 and 40 adjusting the position of the movement of the movable block 34 in the direction of opening and closing the mold are mounted. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006088692(A) 申请公布日期 2006.04.06
申请号 JP20050239796 申请日期 2005.08.22
申请人 APIC YAMADA CORP 发明人 TAKAHASHI YUICHI
分类号 B29C45/26;B29C45/02;B29C45/14;B29C45/56;B29K105/22;B29L9/00;H01L21/56 主分类号 B29C45/26
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