| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat resistant resin which can be used even under the circumstances to possibly cause a serious fault by the contamination of a silicone as in the HDD application, some semiconductor applications and the like, and particularly can be used in dust removal, its manufacturing method, and furthermore, a dust removal substrate using the heat resistant resin. SOLUTION: The heat resistant resin is obtained by polymerizing a tetracarboxylic anhydride and at least a diamine compound containing a polybutadiene skeleton and not containing an acrylonitrile skeleton as a diamine component. Its manufacturing method is described, and the dust removal substrate uses the heat resistant resin. COPYRIGHT: (C)2006,JPO&NCIPI
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