发明名称 LASER PROCESSING APPARATUS AND METHOD USING TEC MODULE
摘要 <p>The object of the present invention is to provide a laser processing apparatus and method, capable of minimizing incurred costs and produced pollutants when processing an object using a laser. The apparatus includes a chuck (30) to hold the object loaded into a chamber. A TEC module (40) is provided on a lower surface of the chuck to cool the object, thus forming a frozen layer on a surface of the object. An insulation means (50) is provided on a lower surface of the TEC module. A laser generating means (120) generates a laser beam. A reflecting means (130) reflects the laser beam onto the object. This invention can process the object with minimal expense, simplify the operation of processing an object, and allows particles produced during the laser process to be easily removed by a cleaning process, thus preventing environmental pollution.</p>
申请公布号 WO2006036038(A1) 申请公布日期 2006.04.06
申请号 WO2004KR03064 申请日期 2004.11.25
申请人 EO TECHNICS CO., LTD.;HAN, YOU-HIE 发明人 HAN, YOU-HIE
分类号 B23K26/42;B23K26/40;(IPC1-7):B23K26/42 主分类号 B23K26/42
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