发明名称 |
Schleifmittel und dieses verwendendes Bohrverfahren |
摘要 |
The present invention relates to an abrasive that decreases the heat generation by a core bit due to boring and allows the boring of a deep hole while maintaining the boring speed even when a deep hole is cut using a dry method. This abrasive contains abrasive grains, particles of anhydrous silica having a particle diameter from 5nm to 50nm and silanol groups in the surface thereof or abrasive grains and hydrous resin which discharges water when the hydrous resin is pressed by a core bit or the temperature of the hydrous resin rises, or abrasive grains and a sublimate. The abrasive (51) is supplied between the distal end of a rotating core bit (11) and a working material (20). <IMAGE> |
申请公布号 |
DE60208602(D1) |
申请公布日期 |
2006.04.06 |
申请号 |
DE2002608602 |
申请日期 |
2002.04.10 |
申请人 |
MITSUBISHI MATERIALS CORP., TOKIO/TOKYO;NIPPON DIAMOND CO., LTD. |
发明人 |
MAZAKI, MITSUBISHI MATERIALS CORP.;KAWAHARA, NIPPON DIAMOND CO. |
分类号 |
B24D3/04;C09K3/14;B24B53/013;B28D1/02;B28D1/04;B28D1/14 |
主分类号 |
B24D3/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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