发明名称 Schleifmittel und dieses verwendendes Bohrverfahren
摘要 The present invention relates to an abrasive that decreases the heat generation by a core bit due to boring and allows the boring of a deep hole while maintaining the boring speed even when a deep hole is cut using a dry method. This abrasive contains abrasive grains, particles of anhydrous silica having a particle diameter from 5nm to 50nm and silanol groups in the surface thereof or abrasive grains and hydrous resin which discharges water when the hydrous resin is pressed by a core bit or the temperature of the hydrous resin rises, or abrasive grains and a sublimate. The abrasive (51) is supplied between the distal end of a rotating core bit (11) and a working material (20). <IMAGE>
申请公布号 DE60208602(D1) 申请公布日期 2006.04.06
申请号 DE2002608602 申请日期 2002.04.10
申请人 MITSUBISHI MATERIALS CORP., TOKIO/TOKYO;NIPPON DIAMOND CO., LTD. 发明人 MAZAKI, MITSUBISHI MATERIALS CORP.;KAWAHARA, NIPPON DIAMOND CO.
分类号 B24D3/04;C09K3/14;B24B53/013;B28D1/02;B28D1/04;B28D1/14 主分类号 B24D3/04
代理机构 代理人
主权项
地址