摘要 |
<p>A semiconductor device comprises a drain, a body in contact with the drain, the body having a body top surface, a source embedded in the body, extending downward from the body top surface into the body, a trench extending through the source and the body to the drain, and a gate disposed in the trench, having a gate top surface that extends, substantially above the body top surface. A method of fabricating a semiconductor device comprises forming a hard mask on a substrate having a top substrate surface, forming a trench in the substrate, through the hard mask, depositing gate material in the trench, where the amount of gate material deposited in the trench extends beyond the top substrate surface, and removing the hard mask to leave a gate structure that extends substantially above the top substrate surface.</p> |
申请人 |
ALPHA & OMEGA SEMICONDUCTOR, INC. |
发明人 |
TAI, SUNG-SHAN;LI, TIESHENG;BHALLA, ANUP;CHANG, HONG;HO, MOSES |