| 摘要 |
PROBLEM TO BE SOLVED: To reduce the cost of a wireless chip or reduce the cost of a wireless chip by mass producing the wireless chip, and provide a small and lightweight wireless chip. SOLUTION: The present invention provides the wireless chip in which a thin-film integrated circuit exfoliated from a glass substrate or a quartz substrate is disposed on a first base substrate and a second base substrate. The wireless chip of the present invention has a small size, a small thickness, and a light weight as compared with a wireless chip made up of a silicon substrate. The thin-film integrated circuit included in the wireless chip of the present invention has at least an N-type thin-film transistor of LDD (Lightly Doped Drain) structure, a P-type thin-film transistor of single drain structure, and a conductive layer acting as an antenna. COPYRIGHT: (C)2006,JPO&NCIPI
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