发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To improve ESD resistance in a semiconductor integrated circuit where a plurality of circuits are provided with the power supply line separated and signal propagation routes are arranged among the circuits. SOLUTION: The semiconductor integrated circuit is provided with a first power supply line and a second power supply line, a first reference potential line and a second reference potential line, a first circuit and a second circuit which are connected to the first and second power supply lines and the first and second reference potential lines, a signal line for connecting the first and second circuits, a protection element connected between the first power supply line and the signal line for applying a current between the first power supply line and signal line in accordance with the applying direction of an over voltage when the over voltage is impressed across the first power supply line and the signal line, and a protection element connected between the second power supply line and the signal line for applying a current between the second power supply line and the signal line in accordance with the applying direction of an over voltage when the over voltage is applied between the signal line and the second power supply line. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006093598(A) 申请公布日期 2006.04.06
申请号 JP20040279969 申请日期 2004.09.27
申请人 TOSHIBA CORP 发明人 YOSHINAGA HIROYUKI
分类号 H01L27/04;H01L21/822 主分类号 H01L27/04
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