| 摘要 |
A cleaning probe capable of providing uniform cleaning to an entire wafer while not damaging the edge portion of the wafer, and a megasonic cleaning apparatus having the cleaning probe are provided. The cleaning probe comprises a front portion located near the center of the wafer, a rear portion connected to a piezoelectric transducer, and a protrusion located between the rear portion and the front portion, located on an edge portion of the wafer, and having a larger cross section width than the front portion.
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