A semiconductor device is provided with a semiconductor chip having a functional plane wherein a functional element is provided; an electrode pad arranged directly above the functional element, on the functional plane of the semiconductor chip; a protecting resin layer stacked on the functional plane of the semiconductor chip; an external connecting terminal provided at a position facing the electrode pad, on the protecting resin layer; and a post which is provided by penetrating the protecting resin layer in a direction where the electrode pad and the external connecting terminal face, for connecting the electrode pad with the external connecting terminal.
