Verfahren zum Verbinden eines Halbleiterchips mit einem Chipträger und Anordnung mit einem Halbleiterchip und einem Chipträger

摘要

A semiconductor chip arrangement and method is disclosed. In one embodiment, the invention provides a method for providing a semiconductor chip arrangement including providing a semiconductor chip having a first connecting area, and providing a chip carrier having a concave shaped section formed in a second connecting area. A connecting mechanism is provided between the first connecting area and the second connecting area and pressing the semiconductor chip onto the chip carrier such that the connecting mechanism positively locks the first connecting area to the concave shaped section of the second connecting area.