发明名称 |
UNTERFÜLLMATERIAL FÜR HALBLEITERGEHÄUSE |
摘要 |
<p>An underfilling material for a semiconductor package holding semiconductor elements on a carrier substrate mounted on a circuit board, containing a one-pack type thermosetting urethane composition which preferably comprises a urethane prepolymer having a terminal isocyanate group, which is obtained by reacting a polyol with an excessive amount of a polyisocyanate, and a fine powder-coated curing agent comprising a curing agent which is in a solid state at room temperature and surface active sites of which are covered with a fine powder. This composition can achieve both the low temperature curing properties and the storage stability.</p> |
申请公布号 |
DE60025489(D1) |
申请公布日期 |
2006.04.06 |
申请号 |
DE2000625489 |
申请日期 |
2000.07.06 |
申请人 |
SUNSTAR GIKEN K.K., TAKATSUKI;SUNSTAR SUISSE S.A., ECUBLENS |
发明人 |
GOTOH, JOHSHI;OKUNO, TATSUYA |
分类号 |
C08G18/10;H05K3/30;H01L21/56;H01L21/60;H05K3/28;H05K3/34 |
主分类号 |
C08G18/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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