发明名称 Scharnier und Vorrichtung mit Scharnier
摘要 A hinge for electronic apparatus effects heat dissipation without having to increase the size ofthe electronic apparatus. Hinges (1A and 1B) for electronic apparatus are provided for the purpose of foldably connecting a first portion (2) and a second portion (3) of an electronic apparatus. Each hinge includes a stationary member (11) which has a strength maintaining portion (11a) for maintaining mechanical strength and a heat conducting portion (12) for effecting heat conduction and which is provided on the first portion (2), a movable member (17) which has a strength maintaining portion (17a) for maintaining mechanical strength and a heat conducting portion (13) for effecting heat conduction and which is provided on the second portion (3), and a joint portion (30) for joining the stationary member (11a) and the movable member (17) to each other while effecting heat conduction between the heat conducting portion (11a) of the stationary member and the heat conducting portion (13) of the movable member. <IMAGE>
申请公布号 DE69833165(D1) 申请公布日期 2006.04.06
申请号 DE1998633165 申请日期 1998.09.22
申请人 SONY CORP., TOKIO/TOKYO 发明人 TANAHASHI, INT. PROP. DEPT.;ASAWA, C/O INT. PROP. DEPT.
分类号 E05D7/00;E05D11/00;E05D9/00;E05D11/08;E05F1/12;G06F1/16;H05K5/03;H05K7/20 主分类号 E05D7/00
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