发明名称 DEVICE AND METHOD FOR ASSEMBLING WORK
摘要 PROBLEM TO BE SOLVED: To provide an assembly device and an assembly method for a work for reducing a device occupation area and realizing high productivity. SOLUTION: The assembly device for the work bonds substrates 6 of first works and a glass panel 4 of a second work and assembles them. A substrate supply position [A] where the substrates 6 are supplied, a first work stand-by position [C] for supplying a bonding material, and a second work stand-by position [E] for bonding the substrates 6 and the glass panel 4, are set in a circulation path by a circulation shift mechanism 10. The circulation shift mechanism 10 circulates a work holder 20, and the substrates 6 after a supply process are shifted to the first work stand-by position [C]. The substrates 6 after supply of the bonding member are shifted to the second work stand-by position [E]. The empty work holder 20 after bonding is shifted to the substrate supply position [A]. Thus, the work assembly device is supplied in which the device occupation area is reduced and high productivity is realized. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006093534(A) 申请公布日期 2006.04.06
申请号 JP20040279077 申请日期 2004.09.27
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NAKANISHI TOMOAKI
分类号 H01L21/60;H05K3/32;H05K3/36 主分类号 H01L21/60
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