发明名称 GROUNDING STRUCTURE OF ELECTRONIC MACHINE
摘要 PROBLEM TO BE SOLVED: To provide a grounding structure of an electronic machine capable of connecting each connector mounted on a substrate to the ground in its adjacent position. SOLUTION: Electric conduction between a frame 4 and the substrate 5, that is grounding connection of the frame ground pattern, is attained by a ground spring 11 formed of a conductive material. The ground spring 11 is a U-shaped leaf spring including both end pieces folded to face each other. The spring 11 is pinched so that one of the pieces comes into contact with the external surface of the frame 4, and the other piece comes into contact with the inner peripheral surface on the side of the frame 4 of a ground spring attachment hole 10. The two pieces of the ground spring 11, while pinched, are biased to come closer to each other. One of the pieces is pressed against the external surface of the frame 4, and the other is pressed against the inner peripheral surface on the side of the frame 4 of the ground spring attachment hole 10. The FG pattern formed on the substrate 5 is thus electrically conductive with the frame 4. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006093475(A) 申请公布日期 2006.04.06
申请号 JP20040278545 申请日期 2004.09.24
申请人 SHARP CORP 发明人 KATAYAMA KENJI
分类号 H05K7/14;H01R4/64;H05K9/00 主分类号 H05K7/14
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