| 发明名称 |
Integrated circuit and method for manufacturing |
| 摘要 |
A semiconductor structure, fluid ejection device, and methods for manufacturing the same are provided, such that a contact to a substrate is formed from a conductive layer.
|
| 申请公布号 |
US2006071281(A1) |
申请公布日期 |
2006.04.06 |
| 申请号 |
US20040977091 |
申请日期 |
2004.10.29 |
| 申请人 |
DODD SIMON;WANG S J;TOM DENNIS W;BRYANT FRANK R;MCMAHON TERRY E;MILLER RICHARD T;HINDMAN GREGORY T |
发明人 |
DODD SIMON;WANG S. J.;TOM DENNIS W.;BRYANT FRANK R.;MCMAHON TERRY E.;MILLER RICHARD T.;HINDMAN GREGORY T. |
| 分类号 |
H01L29/94 |
主分类号 |
H01L29/94 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
