SEMICONDUCTOR COMPONENT COMPRISING SEMICONDUCTOR COMPONENT PARTS THAT ARE POTTED IN A PLASTIC HOUSING MASS

摘要

The invention relates to a semiconductor component with semiconductor component parts (3) that are potted in a plastic housing mass and in particular to the use of silicon and organometallic compounds for creating an adhesion promoter layer (5). Said adhesion promoter layer (5) on the surfaces (4) of the semiconductor component parts (3) of a semiconductor component has a microporous morphology (6) and an average thickness D of 5 nm = D = 300 nm. The adhesion promoter layer (5) comprises semiconductor and/or metal oxides of a reactive compound consisting of oxygen molecules and organometallic molecules.