RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME

摘要

Resin compositions which contain compounds having structures represented by the general formula (1) and which can be converted by heat treatment into ones having high heat resistance and low permittivity; varnishes containing the same; and semiconductor devices made by using the varnishes: (1) wherein Ar is an aromatic group; a is 0 or 1; R<sub