| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component free from delamination and having high sizing accuracy. <P>SOLUTION: The manufacturing method of an electronic component includes a step of forming a conductor layer 2 on a support 1; a step of forming a first CGS layer 3 on the support 1; steps of applying and drying ceramic slurry 4 on the first CGS layer 3 to form a second CGS layer 4', and obtaining a laminate CGS 5 composed of the conductor layer 2 and the first and second CGS layers 3 and 4'; a step of laminating and heating a plurality of laminate CGS 5 to make a CGS laminate 6; and a step of baking the CGS laminate 6. The ceramic slurry 4 contains a molten composition which melts when heated for forming the CGS laminate 6, and a difference is 3 to 8 between the dissolution parameter of the first CGS layer 3 and the dissolution parameter of the ceramic slurry 4. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
