发明名称 POSITIVE RESIST COMPOSITION AND METHOD FOR FORMING PATTERN BY USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To solve problems in techniques of improving performances in microprocessing of a semiconductor devices using high energy beams, X-rays, electron beams or EUV (extreme ultraviolet) light, to provide a positive resist composition having all of satisfying high sensitivity, high resolution, preferable line edge roughness and preferable exposure latitude, and to provide a method for forming a pattern by using the composition. <P>SOLUTION: The positive resist composition contains: a resin which contains a repeating unit having at least two kinds of specified structures and which is decomposed by the effect of an acid to increase the solubility with an alkali developer solution; and a compound which generates an acid by irradiation with active rays or radiation. The method for forming a pattern is carried out by using the composition. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006091677(A) 申请公布日期 2006.04.06
申请号 JP20040279490 申请日期 2004.09.27
申请人 FUJI PHOTO FILM CO LTD 发明人 SASAKI TOMOYA
分类号 G03F7/039;G03F7/004;G03F7/033;H01L21/027 主分类号 G03F7/039
代理机构 代理人
主权项
地址