发明名称 FLOW SOLDERING APPARATUS
摘要 PROBLEM TO BE SOLVED: To prevent an oxide film from occurring on the surface of a jet wave of molten solder, attaching to the printed wiring board of a work to be soldered, and generating solder bridges, at the time of flow soldering of the printed wiring board. SOLUTION: By forming a wavy end 71 in an end in the flowing direction of a guide board 70 which guides the flowing down of each jet wave generated by molten solder inside a solder bath, a distribution sequence can be formed wherein a flow portion of rapid fluid velocity and a flow portion of relatively slow fluid velocity are alternately formed, on the downstream portion of each jet wave. Thereby, force which tends to run and push down an oxide film extended filmily on the surface of the jet wave running down on the guide board 70 is distributed in the shape of comb teeth and unevenly applied. Therefore, the oxide film which tends to run up on the jet wave is cut off and pushed down by the portion of jet wave of rapid fluid velocity, and consequently the oxide film can hardly develop. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006093281(A) 申请公布日期 2006.04.06
申请号 JP20040274792 申请日期 2004.09.22
申请人 NIHON DENNETSU KEIKI CO LTD 发明人 YAMAMOTO OSAMU
分类号 H05K3/34;B23K1/08;B23K101/42 主分类号 H05K3/34
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