发明名称 Elektronisches Bauteil mit mindestens einer Isolationslage
摘要 <p>An electronic component and a method of producing it, with at least one insulating layer is encompassed by the invention. The insulating layer includes a polymer including norbornene monomers. The polymer retains a double ring structure of the monomer C<SUB>7</SUB>H<SUB>10 </SUB>while there is breaking of a carbon double bond of the norbornene monomer. This breaking of the carbon double bond is created by a homopolymerization of the monomers to form crosslinked norbornene monomers with polar fluorocarbon bonds.</p>
申请公布号 DE10104267(B4) 申请公布日期 2006.04.06
申请号 DE2001104267 申请日期 2001.01.30
申请人 INFINEON TECHNOLOGIES AG 发明人 HAIMERL, ALFRED
分类号 C08F132/00;H01L21/58;H01L23/29;H01L23/31;H01L23/498;H05K1/03 主分类号 C08F132/00
代理机构 代理人
主权项
地址