发明名称 CONDUCTIVE PARTICLE MANUFACTURING METHOD, CONDUCTIVE PASTE, AND ELECTRONIC COMPONENT MANUFACTURING METHOD
摘要 <p>A conductive particle manufacturing method for efficiently manufacturing core particles coated with a thin coating layer free of abnormal segregation of the metal of the coating layer while suppressing growth of the conductive particles at the baking step even if the thicknesses of the inner electrode layers are decreased, effectively preventing spheroidizatin and electrode disconnection, and effectively suppressing the lowering of the capacitance. The conductive particles each comprise a core portion (51) made mainly of nickel and a coating layer (52) coating around the surface. The core powder, a water-soluble metal salt containing the metal or alloy of the coating layer (52), and a surfactant (or a water-soluble polymer compound) are mixed together, and the metal or alloy of the coating layer (52) is reduction-precipitated on the outer surface of the core powder. The metal or alloy of the coating layer (52) contains as a main component at least one element selected from Ru, Rh, Re, and Pt.</p>
申请公布号 WO2006035840(A1) 申请公布日期 2006.04.06
申请号 WO2005JP17890 申请日期 2005.09.28
申请人 TDK CORPORATION;SUZUKI, KAZUTAKA;SATO, SHIGEKI 发明人 SUZUKI, KAZUTAKA;SATO, SHIGEKI
分类号 B22F1/02;B22F1/00;H01B1/22;H01B13/00;H01G4/12 主分类号 B22F1/02
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