| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem that, since a conventional semiconductor device is defenceless to external noise, a semiconductor chip malfunctions. <P>SOLUTION: In the semiconductor device, upper and lower faces of a semiconductor chip 4 mounted on a bottom board 1 are coated with earth patterns 1d, 3a, its side face is surrounded by a through hole 6, and the bottom board is connected to the earth pattern of a printed board, thereby shielding the total periphery of the semiconductor chip. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
