| 摘要 |
An FEM is provided. The FEM includes a first substrate having a plurality of sheets stacked therein, a second substrate having a plurality of sheets stacked therein and sequentially disposed with respect to the first substrate, a first chip mounted on an inner space of the first substrate, and a second chip mounted on an inner space of the second substrate. Consequently, a chip for power amplification and a chip for a duplexer are not interfered with each other and a size of the FEM is minimized. |
