| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board effectively preventing a deformation such as the warp of an insulating base body even when the wiring board is changed into a multifunction, a multilayer, and a thinned structure. SOLUTION: The wiring board 9 has the insulating base body 1, on the top face of which an electronic part is loaded and which is composed of ceramics, a wiring conductor 2 formed to at least one of the inside and surface of the insulating base body 1 and an electrode pad 3 formed on the top face of the insulating base body 1 and electrically connected to an electrode for the electronic part. The wiring board 9 further has a connecting pad 4 formed on the underside of the insulating base body 1 and larger than the electrode pad 3, and an insulating layer 5 formed on the top face of the insulating base body 1 and added with a pigment composed of a metallic oxide to the same ceramics as the ceramics constituting the insulating base body 1. COPYRIGHT: (C)2006,JPO&NCIPI |
