System and method for the probing of a wafer

摘要

According to one embodiment of the invention, a method for probing a wafer includes positioning a testhead relative to a prober supporting a wafer in a testing position. The method also includes receiving at least one prober signal identifying the angular position of the prober and at least one testhead signal identifying the angular position of the testhead. The at least one prober signal and the at least one testhead signal are processed to determine if the testhead is substantially parallel with the prober, and output is provided to allow for adjustment of the position of the testhead in response to determining that the testhead is not substantially parallel with the prober.