发明名称 Fluidized bed cooler for electronic components
摘要 A fluidized bed cooler comprises a blower and a heatsink with a base and heat exchanging means. The blower comprises an electric drive with a stator and a rotor, an impeller and a casing with blower inlet and outlet. The base made as a heat spreader with a plate and provides a thermal contact with the electronic components and the heat exchanging means. The heat exchanging means are surrounded by a housing thus forms a fluidized bed chamber with inflow and outflow side openings. The fluidized bed chamber partially filled up with particulate solids and covered from both openings by intake and outtake grilled structures. The blower hydraulically connected by the inlet with the outflow side opening, so cooling gas flows through the inflow side opening, the fluidized bed chamber thus fluidizing the particulate solids, the outflow side opening, the blower inlet, the impeller and the blower outlet.
申请公布号 US2006070723(A1) 申请公布日期 2006.04.06
申请号 US20050238555 申请日期 2005.09.29
申请人 INDUSTRIAL DESIGN LABORATORIES INC. 发明人 LOPATINSKY EDWARD;FEDOSEYEV LEV
分类号 F28D13/00 主分类号 F28D13/00
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